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US 12,588,139 B2Granted
Wiring board and method for manufacturing wiring board
AssigneeFujikura Ltd.
InventorKazutoshi Koshimizu
Life of this patent
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Abstract
A wiring board includes a first substrate, a second substrate composed of a material different from a material of the first substrate, a wiring supported by the first substrate, and a terminal supported by the second substrate and connected to the wiring. The first and second substrates are disposed on a same side with respect to the wiring. In a plan view, the first substrate overlaps the wiring but not the terminal. In the plan view, the second substrate overlaps the terminal.
Claims4
A wiring board comprising:
- a first substrate;
- a second substrate composed of a material different from a material of the first substrate;
- a wiring supported by the first substrate;
- and
- a terminal supported by the second substrate and connected to the wiring, wherein
- the first and second substrates are disposed on a same side with respect to the wiring,
- in a PLAN view:
- the first substrate overlaps the wiring but not the terminal, and
- the second substrate overlaps the terminal,
- the wiring board further comprises:
- a body portion comprising the first substrate and the wiring;
- and
- a tail portion extending from the body portion and comprising the second substrate and the terminal,
- the second substrate comprises:
- a first reinforcing board;
- and
- a second reinforcing board laminated to the first reinforcing board,
- the first and second reinforcing boards overlap the terminal in the PLAN view,
- the first reinforcing board is disposed between the terminal and the second reinforcing board,
- the first reinforcing board contacts the first substrate,
- the second reinforcing board is disposed apart from the first substrate, and
- the second reinforcing board does not overlap the first substrate in the PLAN view.
19 more elements
Dependencies are inferred from the claim text.