H05K 3/247
Finish coating of conductors by using conductive pastes, inks or powders
Official title: {Finish coating of conductors by using conductive pastes, inks or powders}
H05K3/247 (Finish coating of conductors by using conductive pastes, inks or powders) appears on 188 US grants and 150 published applications in this corpus.
Search patents in H05K- Granted patents
- 188
- Published applications
- 150
- Assignees
- 132
- Inventors
- 451
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 1 |
| 2002 | 7 | 10 |
| 2003 | 6 | 7 |
| 2004 | 7 | 10 |
| 2005 | 7 | 12 |
| 2006 | 6 | 7 |
| 2007 | 6 | 5 |
| 2008 | 5 | 7 |
| 2009 | 2 | 10 |
| 2010 | 4 | 15 |
| 2011 | 7 | 7 |
| 2012 | 10 | 4 |
| 2013 | 5 | 1 |
| 2014 | 3 | 6 |
| 2015 | 0 | 6 |
| 2016 | 4 | 2 |
| 2017 | 6 | 4 |
| 2018 | 3 | 2 |
| 2019 | 2 | 6 |
| 2020 | 5 | 3 |
| 2021 | 6 | 10 |
| 2022 | 4 | 4 |
| 2023 | 1 | 4 |
| 2024 | 4 | 3 |
| 2025 | 2 | 3 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Wiring board and method for manufacturing wiring board24 Mar 2026US 12,588,139 B2Fujikura Ltd.
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Flexible printed circuit board, COF module, and electronic device comprising the same4 Feb 2025US 12,219,705 B2LG Innotek Co., Ltd.
- Surface-treated glass cloth, prepreg, and printed wiring board16 Jul 2024US 12,041,727 B2Nitto Boseki Co., Ltd.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Process for manufacturing a printed circuit board and printed circuit board11 Sep 2025US 2025/0287511 A1
- Article with catalytic ink and electrically-conductive pattern30 Jan 2025US 2025/0040044 A1Eastman Kodak Company
- Coating or surface treatment method, substrate and apparatus16 Jan 2025US 2025/0019855 A1Fepod Oy Ltd
- Wiring harness production method and wiring harness10 Oct 2024US 2024/0339248 A1Changchun Jetty Automotive Technology Co., Ltd.
Most cited
By later US patents
- Electrical conductivity-enhancing and protecting material247US 4,578,215 AMicro-Circuits Company · 1986
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Ceramic substrate for implantable medical devices125US 5,855,995 AMedtronic, Inc. · 1999
- Economical high density chip carrier113US 6,753,612 B2International Business Machines Corporation · 2004
- Barrier metallization in ceramic substrate for implantable medical devices77US 6,146,743 AMedtronic, Inc. · 2000