H05K 3/249
Comprising carbon particles as main constituent
Official title: {comprising carbon particles as main constituent}
H05K3/249 (Comprising carbon particles as main constituent) appears on 28 US grants and 40 published applications in this corpus.
Search patents in H05K- Granted patents
- 28
- Published applications
- 40
- Assignees
- 37
- Inventors
- 94
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 3 |
| 2003 | 0 | 1 |
| 2004 | 2 | 0 |
| 2005 | 1 | 3 |
| 2006 | 1 | 1 |
| 2007 | 1 | 0 |
| 2008 | 1 | 4 |
| 2009 | 1 | 4 |
| 2010 | 1 | 8 |
| 2011 | 2 | 3 |
| 2012 | 4 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 2 | 3 |
| 2020 | 1 | 0 |
| 2021 | 0 | 3 |
| 2022 | 2 | 1 |
| 2023 | 0 | 2 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board and method for manufacturing wiring board24 Mar 2026US 12,588,139 B2Fujikura Ltd.
- Surface-treated glass cloth, prepreg, and printed wiring board16 Jul 2024US 12,041,727 B2Nitto Boseki Co., Ltd.
- Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring9 Jul 2024US 12,035,470 B2Tanaka Kikinzoku Kogyo K.K.
- Chemical vapor deposition diamond (CVDD) wires for thermal transport1 Nov 2022US 11,488,888 B2Microchip Technology Caldicot Limited
- Composite transparent conductors and methods of forming the same11 Jan 2022US 11,224,130 B2Cambrios Film Solutions Corporation
- Wiring harness production method and wiring harness10 Oct 2024US 2024/0339248 A1Changchun Jetty Automotive Technology Co., Ltd.
- Wiring board and method for manufacturing wiring board7 Dec 2023US 2023/0397328 A1Fujikura Ltd.
- Surface-treated glass cloth, prepreg, and printed wiring board9 Mar 2023US 2023/0071895 A1Nitto Boseki Co., Ltd.
- Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring13 Jan 2022US 2022/0015232 A1Tanaka Kikinzoku Kogyo K.K.
- Optically-enabled server with carbon nanotubes-based memory9 Sep 2021US 2021/0280248 A1Honeycomb Secure Systems, Inc.
Most cited
By later US patents
- Nanowire-based transparent conductors and applications thereof72US 8,094,247 B2Cambrios Technologies Corporation · 2012
- Electronic pressure sensitive transducer apparatus and method for manufacturing same67US 6,909,354 B2Interlink Electronics, Inc. · 2005
- Method of forming an electronic pressure sensitive transducer on a printed circuit board62US 7,213,323 B2Interlink Electronics, Inc. · 2007
- Composite transparent conductors and methods of forming the same45US 8,018,563 B2Cambrios Technologies Corporation · 2011
- Self-assembled nanometer conductive bumps and method for fabricating39US 6,989,325 B2Industrial Technology Research Institute · 2006