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US 6,989,325 B2Granted
Self-assembled nanometer conductive bumps and method for fabricating
AssigneeIndustrial Technology Research Institute
InventorsRuoh-Huey Uang, Yu-Hua Chen
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Abstract
A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is then positioned juxtaposed to the carbon nanotubes for forming a bond between the carbon nanotubes and the metal pads facilitated by a chemical affinity existed between the functional groups and the metal pad.
Claims6
A self-assembly method for fabricating nanometer conductive bumps comprising the steps of:
- providing a multiplicity of carbon nanotubes, each of said multiplicity of carbon nanotubes having two free ends;
- attaching to said two free ends of said multiplicity of carbon nanotubes a plurality of functional groups;
- providing a template having at least one metal pad on a surface;
- attaching said multiplicity of carbon nanotubes to said at least one metal pad by an attraction force existed between said plurality of functional groups on said free end of said carbon nanotubes and said metal pad;
- attaching a multiplicity of nanometer metal balls to the other free end of said multiplicity of carbon nanotubes forming a nanometer metal layer;
- providing a substrate having at least a bond pad on a surface;
- attaching said nanometer metal layer on said multiplicity of carbon nanotubes to said bond pad on the substrate;
- and
- removing said template.
6 more elements
Dependencies are inferred from the claim text.