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US 2023/0397328 A1Published application
Wiring board and method for manufacturing wiring board
AssigneeFujikura Ltd.
InventorKazutoshi Koshimizu
Life of this patent
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Abstract
A wiring board includes a first substrate, a second substrate composed of a material different from a material of the first substrate, a wiring supported by the first substrate, and a terminal supported by the second substrate and connected to the wiring. The first and second substrates are disposed on a same side with respect to the wiring. In a plan view, the first substrate overlaps the wiring but not the terminal. In the plan view, the second substrate overlaps the terminal.
Claims8
A wiring board comprising:
- a first substrate;
- a second substrate composed of a material different from a material of the first substrate;
- a wiring supported by the first substrate;
- and
- a terminal supported by the second substrate and connected to the wiring, wherein
- the first and second substrates are disposed on a same side with respect to the wiring, and
- in a plan view:
- the first substrate overlaps the wiring but not the terminal, and
- the second substrate overlaps the terminal.
6 more elements
A method for manufacturing a wiring board, comprising:
- forming an overcoat layer on a release film;
- forming a wiring on the overcoat layer and forming a terminal connected to the wiring on the release film;
- forming a primer layer on the overcoat layer, the wiring, and the terminal;
- and
- laminating a first substrate and a second substrate to the primer layer, wherein the first and the second substrate are composed of different materials.
2 more elements
Dependencies are inferred from the claim text.