Chemical vapor deposition diamond (CVDD) wires for thermal transport
AssigneeMicrochip Technology Caldicot Limited
InventorsPhilip Andrew Swire, Nina Biddle
Life of this patent
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Abstract
A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.
Claims20
A method for forming a board assembly comprising:
- identifying a location of a hot-spot on the semiconductor die;
- attaching a first Chemical Vapor Deposition Diamond (CVDD) coated wire to a first circuit board in a location corresponding to the location of the identified hot-spot;
- applying a layer of thermally conductive paste over the first CVDD-coated wire;
- and
- placing a semiconductor die over the layer of thermally conductive paste such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste and such that a portion of the first CVDD-coated wire extends between the identified location of the hot-spot on the semiconductor die and the first circuit board.
A board assembly comprising:
- a first circuit board;
- a semiconductor die electrically coupled to the first circuit board;
- a first Chemical Vapor Deposition Diamond (CVDD) coated wire, a portion of the first CVDD-coated wire extending between a hot-spot on the semiconductor die and the first circuit board;
- and
- a layer of thermally conductive paste disposed between the hot-spot on the semiconductor die and the first circuit board, the layer of thermally conductive paste in direct contact with a portion of the CVDD-coated wire.
A board assembly comprising:
- a first circuit board;
- a second circuit board overlying the first circuit board;
- a semiconductor die electrically coupled to the first circuit board and disposed between the first and second circuit board;
- a first Chemical Vapor Deposition Diamond (CVDD) coated wire extending within a first slot in the first circuit board, a portion of the first CVDD-coated wire extending between a hot-spot on the semiconductor die and the first circuit board;
- and
- a layer of thermally conductive paste disposed between the hot-spot on the semiconductor die and the first circuit board, the layer of thermally conductive paste in direct contact with a portion of the CVDD-coated wire;
- and
- one or more heat sink coupled to the first CVDD-coated wire and to the first circuit board.
Dependencies are inferred from the claim text.