H05K 3/248
Fired compositions for inorganic substrates
Official title: {fired compositions for inorganic substrates}
H05K3/248 (Fired compositions for inorganic substrates) appears on 77 US grants and 38 published applications in this corpus.
Search patents in H05K- Granted patents
- 77
- Published applications
- 38
- Assignees
- 43
- Inventors
- 169
- Latest grant
- 13 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 1 |
| 2002 | 4 | 4 |
| 2003 | 6 | 3 |
| 2004 | 2 | 4 |
| 2005 | 2 | 5 |
| 2006 | 2 | 6 |
| 2007 | 3 | 1 |
| 2008 | 4 | 1 |
| 2009 | 0 | 2 |
| 2010 | 2 | 3 |
| 2011 | 2 | 2 |
| 2012 | 2 | 1 |
| 2013 | 2 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 2 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electronic component and method for producing same13 Feb 2024US 11,903,144 B2Material Concept, Inc.
- High frequency component8 Sep 2020US 10,770,223 B2Murata Manufacturing Co., Ltd.
- Power module substrate with Ag underlayer and power module10 Apr 2018US 9,941,235 B2Mitsubishi Materials Corporation
- Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part27 Jun 2017US 9,693,449 B2Mitsubishi Materials Corporation
- Semiconductor substrate, electrode forming method, and solar cell fabricating method1 Jul 2014US 8,766,089 B2Shin-Etsu Chemical Co., Ltd.
- Electronic component and method for producing same3 Mar 2022US 2022/0071024 A1Material Concept, Inc.
- High frequency component7 Feb 2019US 2019/0043662 A1Murata Manufacturing Co., Ltd.
- Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate26 Oct 2017US 2017/0311455 A1Epcos AG
- Power module substrate with ag underlayer and power module12 Oct 2017US 2017/0294399 A1Mitsubishi Materials Corporation
- Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part28 Jul 2016US 2016/0219693 A1Mitsubishi Materials Corporation
Most cited
By later US patents
- Ceramic substrate for implantable medical devices125US 5,855,995 AMedtronic, Inc. · 1999
- Barrier metallization in ceramic substrate for implantable medical devices77US 6,146,743 AMedtronic, Inc. · 2000
- Barrier metallization in ceramic substrate for implantable medical devices68US 6,284,080 B1Medtronic, Inc. · 2001
- Multilayer ceramic substrate with circuit patterns67US 4,795,670 ANarumi China Corporation · 1989
- Method of making ceramic substrate66US 6,041,496 AMedtronic, Inc. · 2000