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AssigneeEpcos AG
InventorsSebastian Brunner, Gerhard Fuchs, Annette Fischer
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A method for producing a multilayer substrate (1) is specified, wherein a main body (26) comprising a plurality of ceramic layers (2) is provided, wherein at least one layer (2) comprises a hole (27). In order to form a plated-through hole (4, 18, 20, 21), the hole (27) is filled with a metal by depositing the metal from a solution. Furthermore, a multilayer substrate is specified wherein a plated-through hole (4, 18, 20, 21) in the interior of the main body (26) is connected to a further contact (11), wherein the plated-through hole (4, 18, 20, 21) comprises a different material than the further contact (11) and/or is produced by a different method. macros hash =multilayer substrate star =plated-throuch hole pie =connection contact alpha =photoresist mask beta =further contact gamma =HTCC technology delta =main body matt =ceramic layer
A method for producing a multilayer substrate,
A multilayer substrate, comprising a main body (26) having a plurality of ceramic layers (2), wherein at least one of the layers (2) comprises a plated-through hole (4, 18, 20, 21) containing a metal introduced by deposition from a solution.
A multilayer substrate, comprising a main body (26) having a plurality of ceramic layers (2), wherein the multilayer substrate comprises a plated-through hole (4, 18, 20, 21) and a further contact (11) connected thereto, wherein the plated-through hole (4, 18, 20, 21) leads through at least one of the layers (2), and the further contact (11) is arranged in the interior of the main body (26), and wherein the plated-through hole (4, 18, 20, 21) comprises a different material than the further contact (11) and/or is produced by a different production method.
A multilayer substrate, comprising a main body (26) having a plurality of ceramic layers (2), wherein the main body (26) is produced using HTCC technology and comprises a plated-through hole (4, 18, 20, 21) leading through at least one of the layers, wherein the plated-through hole (4, 18, 20, 21) contains copper.
Dependencies are inferred from the claim text.