Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part
AssigneeMitsubishi Materials Corporation
InventorsShuji Nishimoto, Yoshiyuki Nagatomo
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Abstract
A power module substrate includes an insulating layer, a circuit layer that is formed on a first surface of the insulating layer, and a metal layer that is formed on a second surface of the insulating layer, in which a first base layer is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.
Claims14
A power module substrate with a metal part comprising:
- an insulating layer;
- a circuit layer that is formed on a first surface of the insulating layer;
- and
- a metal part that is bonded to a metal layer side of the power module substrate;
- a metal layer that is formed on a second surface of the insulating layer;
- and
- a metal part that is bonded to a metal layer side of the power module substrate, wherein
- a first base layer, to which a bonding layer composed of a sintered body of a bonding material including at least one of metal particles and metal oxide particles is bonded, is laminated on a surface of the metal layer on an opposite side of the surface, to which the insulating layer is provided,
- the first base layer has:
- a first glass layer that is formed at the interface with the metal layer, and a first Ag layer that is laminated on the first glass layer,
- the bonding layer that is composed of a sintered metal material is formed between the first base layer and the metal part, and
- the bonding layer of the power module substrate with a metal part is composed of a sintered body of a bonding material including at least one of metal Ag particles and Ag oxide particles.
A method for producing a power module substrate with a metal part including a power module substrate having a circuit layer that is formed on a first surface of an insulating layer and a metal layer that is formed on a second surface of the insulating layer, and a metal part that is bonded to the metal layer side of the power module substrate, the method comprising the steps of:
- forming a first base layer, to which a bonding layer composed of a sintered body of a bonding material including at least one of metal particles and metal oxide particles is bonded, by:
- applying a glass-containing Ag paste containing a glass component onto a surface of the metal layer on the opposite side of the surface, to which the insulating layer is provided;
- and performing a heating treatment;
- applying a bonding material including at least one of metal Ag particles and Ag oxide particles onto the surface of the first base layer;
- laminating a metal part on the applied bonding material;
- and
- forming a bonding layer that bonds the first base layer and the metal part by heating the power module substrate and the metal part in a state in which the power module substrate and the metal part are laminated.
Dependencies are inferred from the claim text.