High frequency component
AssigneeMurata Manufacturing Co., Ltd.
InventorIssei Yamamoto
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Abstract
The present disclosure is intended to reduce connection resistance between a shield film and a ground electrode, and to improve characteristics of the shield film. A high frequency component 1a includes a ceramic substrate 2, a ground electrode 3a disposed inside the ceramic substrate 2, a shield film 4 covering an upper surface 2a and lateral surfaces 2c of the ceramic substrate 2, and connecting portions 6a connecting the ground electrode 3a and the shield film 4, wherein the ground electrode 3a is formed using a conductive paste that contains a metal ingredient, powder, and a material constituting the ceramic substrate 2, and a weight rate of a metal ingredient in the connecting portions 6a is higher than that of the metal ingredient in the ground electrode 3a.
Claims19
A high frequency component comprising:
- a ceramic substrate;
- a ground electrode disposed inside the ceramic substrate;
- a shield film covering at least a lateral surface among surfaces of the ceramic substrate;
- and
- a connecting portion connecting the ground electrode and the shield film to each other,
- wherein a weight ratio of a metal ingredient in the connecting portion is higher than a weight ratio of a metal ingredient in the ground electrode,
- the connecting portion is disposed inside of the shield film.
Dependencies are inferred from the claim text.