Electronic component and method for producing same

A method for producing an electronic component, comprising:

• applying a first paste to an inorganic substrate,
• the first paste comprising copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point;
• applying a second paste,
• the second paste comprising copper particles, oxide particles comprising copper and/or nickel, and no inorganic oxide component having a softening point or
• the second paste comprising copper particles, oxide particles comprising copper and/or nickel, and an inorganic oxide component having softening point in a content of less than 0.1% by mass;
• forming a sintered body comprising at least copper through heating in an inert gas atmosphere at a temperature being equal to or higher than the sintering temperature of the copper particles and lower than the softening point of the inorganic oxide particles as well as being in a range of 400° C. or more and 620° C. or less for 5 minutes or more and 60 minutes or less;
• followed by
• performing heating in an inert gas atmosphere at a temperature being equal to or higher than the softening point of the inorganic oxide particles as well as being in a range of 650° C. or more and 870° C. or less for 5 minutes or more and 60 minutes or less.

A method for producing an electronic component, the method comprising:

• applying a first paste to an inorganic substrate,
• the first paste comprising copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point;
• forming a sintered body comprising at least copper through heating in an inert gas atmosphere at a temperature being equal to or higher than a sintering temperature of the copper particles and lower than the softening point of the inorganic oxide particles as well as being in a range of 400° C. or more and 620° C. or less for 5 minutes or more and 60 minutes or less;
• followed by
• performing heating in an inert gas atmosphere at a temperature being equal to or higher than the softening point of the inorganic oxide particles as well as being in a range of 650° C. or more and 870° C. or less for 5 minutes or more and 60 minutes or less;
• applying a second paste,
• the second paste comprising copper particles, oxide particles comprising copper and/or nickel, and no inorganic oxide component having a softening point or
• the second paste comprising copper particles, oxide particles comprising copper and/or nickel, and an inorganic oxide component having a softening point in a content of less than 0.1% by mass;
• and
• forming a sintered body comprising at least copper through heating in an inert gas atmosphere at a temperature equal to or higher than the sintering temperature of the copper particles.