H05K 3/26
Cleaning or polishing of the conductive pattern
H05K3/26 (Cleaning or polishing of the conductive pattern) appears on 642 US grants and 519 published applications in this corpus.
Search patents in H05K- Granted patents
- 642
- Published applications
- 519
- Assignees
- 382
- Inventors
- 1,511
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 11 | 0 |
| 1990 | 14 | 0 |
| 1991 | 30 | 0 |
| 1992 | 22 | 0 |
| 1993 | 45 | 0 |
| 1994 | 29 | 0 |
| 1995 | 28 | 0 |
| 1996 | 26 | 0 |
| 1997 | 24 | 0 |
| 1998 | 36 | 0 |
| 1999 | 28 | 0 |
| 2000 | 16 | 0 |
| 2001 | 20 | 11 |
| 2002 | 21 | 13 |
| 2003 | 19 | 19 |
| 2004 | 14 | 31 |
| 2005 | 11 | 22 |
| 2006 | 11 | 31 |
| 2007 | 12 | 24 |
| 2008 | 8 | 21 |
| 2009 | 10 | 20 |
| 2010 | 8 | 11 |
| 2011 | 11 | 13 |
| 2012 | 6 | 5 |
| 2013 | 8 | 12 |
| 2014 | 10 | 14 |
| 2015 | 9 | 18 |
| 2016 | 10 | 17 |
| 2017 | 3 | 20 |
| 2018 | 19 | 15 |
| 2019 | 11 | 18 |
| 2020 | 14 | 18 |
| 2021 | 12 | 15 |
| 2022 | 19 | 9 |
| 2023 | 4 | 14 |
| 2024 | 8 | 15 |
| 2025 | 6 | 13 |
| 2026 | 7 | 100 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness8 Sep 2026US 12,733,110 B2Iee International Electronics & Engineering S.A.
- Method for manufacturing ceramic circuit board30 Jun 2026US 12,667,900 B2Niterra Materials Co., Ltd.
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method16 Jun 2026US 12,655,370 B2Tokyo Ohka Kogyo.Co., Ltd.
- Effluent management inline cleaner28 Apr 2026US 12,615,718 B2Illinois Tool Works Inc.
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
Most cited
By later US patents
- Method and apparatus for feeding and coating articles in a controlled atmosphere353US 4,812,217 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- System for precision cleaning by jet spray210US 5,315,793 AHughes Aircraft Company · 1994
- Supersonic exhaust nozzle having reduced noise levels for CO.sub.2 cleaning system199US 5,390,450 AFord Motor Company · 1995
- Surface mount semiconductor package197US 6,204,554 B1International Rectifier Corporation · 2001
- Photoreactive surface processing160US 5,669,979 AUVTech Systems, Inc. · 1997