Back to results
US 12,655,370 B2Granted
Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsIvan Ryzhii, Mai Sugawara, Yugeng Wu
Life of this patent
Estimating the term…
Abstract
A metal residue removing liquid including a mixed solvent containing a first organic solvent and a second organic solvent, a salt of a base containing no metal ions and hydrofluoric acid, and water, in which the first organic solvent is diethylformamide, and the mixed solvent has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term of a Hansen solubility parameter from a polar term of the Hansen solubility parameter.
Claims9
A metal residue removing liquid, comprising:
- a mixed solvent (S0) that contains a first organic solvent (S1) and a second organic solvent (S2);
- a salt (F) of a base containing no metal ions and hydrofluoric acid;
- and
- water,
- wherein the first organic solvent (S1) is diethylformamide,
- the mixed solvent (S0) has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term (δH) of a Hansen solubility parameter from a polar term (δP) of a Hansen solubility parameter, and
- a content of the first organic solvent (S1) is 40 to 70% by mass with respect to the total mass of the metal residue removing liquid.
4 more elements
Dependencies are inferred from the claim text.