Production method of embedded circuit board

A production method of an embedded circuit board, the method comprising:

• forming a base hole (110) at the substrate (100), the base hole (110) being used for accommodating a chip (200);
• positioning the substrate (100) and the chip (200) using a fixing member (300), and laminating the substrate (100) and the chip (200) onto a first layer plate (400);
• removing the fixing member (300);
• providing an acid cleaning chamber (500) and a plasma cleaning chamber (700) that are formed as an integrated structure, transferring the chip (200) and the substrate (100) to a lifting device (600), driving the chip (200) and the substrate (100) to rise into the plasma cleaning chamber (700) through the lifting device (600), and performing plasma cleaning on the chip (200) and the substrate (100);
• driving the chip (200) and the substrate (100) to descend into the acid cleaning chamber (500) through the lifting device (600), driving a water spray assembly (800) in the acid cleaning chamber (500) to move to a position above the chip (200) and the substrate (100), and uniformly spraying acid cleaning solution onto the chip (200) and the substrate (100);
• taking out the chip (200) and the substrate (100);
• laminating the substrate (100) and the chip (200) onto a second layer plate (410), the first layer plate (400) and the second plate (410) being located at two opposite sides of the chip (200);
• drilling pin holes at the first layer plate (400) and the second layer plate (410) using a laser, the pin holes being used for exposing pins of the chip (200);
• electroplating and filling holes to form a conductive layer in the pin holes;
• and
• forming a circuit on the first layer plate (400) and the second layer plate (410), and welding or soldering components.