Method for manufacturing ceramic circuit board

A method for manufacturing a ceramic circuit board, the method comprising:

• a process of preparing a bonded body in which a copper member is bonded to at least one surface of a ceramic substrate via a brazing material layer, the brazing material layer not including Ag, the brazing material layer including Cu, an active metal, and a first element, the first element being at least one selected from Sn and In;
• a first copper etching process of etching a portion of the copper member and a layer included in the brazing material layer by using at least one of iron chloride or copper chloride in the first copper etching process to expose a part of an active metal reaction layer included in the brazing material layer, the layer included in the brazing material layer including Cu and the first element as major components;
• a first brazing material etching process of etching the exposed part of the active metal reaction layer by using an etchant including one or two selected from hydrogen peroxide and ammonium peroxodisulfate, the etchant having a pH of not less than 4 and not more than 6, a jutting portion of the brazing material layer that juts from the copper member being formed, the jutting portion including a precipitate that includes Cu;
• and
• a first chemical polishing process of chemically polishing the jutting portion, a chemical polishing liquid including sulfuric acid or hydrochloric acid being used to remove the precipitate,
• wherein a length of the jutting portion after the first chemical polishing process is not less than 10 μm and not more than 200 μm.