H05K 3/36
Assembling printed circuits with other printed circuits
Official title: Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)}
H05K3/36 (Assembling printed circuits with other printed circuits) appears on 4,886 US grants and 4,378 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,886
- Published applications
- 4,378
- Assignees
- 1,636
- Inventors
- 10,116
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 16 | 0 |
| 1978 | 15 | 0 |
| 1979 | 10 | 0 |
| 1980 | 7 | 0 |
| 1981 | 15 | 0 |
| 1982 | 11 | 0 |
| 1983 | 14 | 0 |
| 1984 | 14 | 0 |
| 1985 | 24 | 0 |
| 1986 | 31 | 0 |
| 1987 | 46 | 0 |
| 1988 | 30 | 0 |
| 1989 | 47 | 0 |
| 1990 | 44 | 0 |
| 1991 | 74 | 0 |
| 1992 | 64 | 0 |
| 1993 | 60 | 0 |
| 1994 | 74 | 0 |
| 1995 | 76 | 0 |
| 1996 | 91 | 0 |
| 1997 | 83 | 0 |
| 1998 | 115 | 0 |
| 1999 | 124 | 0 |
| 2000 | 126 | 0 |
| 2001 | 143 | 88 |
| 2002 | 159 | 172 |
| 2003 | 155 | 145 |
| 2004 | 159 | 165 |
| 2005 | 113 | 176 |
| 2006 | 120 | 174 |
| 2007 | 118 | 192 |
| 2008 | 115 | 193 |
| 2009 | 115 | 167 |
| 2010 | 131 | 165 |
| 2011 | 148 | 131 |
| 2012 | 121 | 106 |
| 2013 | 105 | 126 |
| 2014 | 75 | 148 |
| 2015 | 135 | 166 |
| 2016 | 123 | 151 |
| 2017 | 146 | 169 |
| 2018 | 178 | 207 |
| 2019 | 201 | 218 |
| 2020 | 184 | 227 |
| 2021 | 186 | 223 |
| 2022 | 206 | 191 |
| 2023 | 154 | 185 |
| 2024 | 162 | 183 |
| 2025 | 141 | 114 |
| 2026 | 75 | 196 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Thermoplastic interposer15 Sep 2026US 12,739,965 B2Meta Platforms Technologies, LLC
- BMS communication system and ESS communication system that wirelessly communicate with each other1 Sep 2026US 12,725,908 B2Samsung SDI.Co., Ltd.
- Flexible interconnect circuits comprising welded connections25 Aug 2026US 12,720,679 B2CelLink Corporation
- Electronic apparatus including flexible printed circuit board25 Aug 2026US 12,720,684 B2Samsung Electronics Co., Ltd.
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Power modules with vertical power flow8 Oct 2026US 2026/0313799 A1Analog Devices International Unlimited Company
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Adhesive and method for manufacturing circuit connection structure8 Oct 2026US 2026/0313803 A1
- Component carrier, method for manufacturing a component carrier and component carrier assembly1 Oct 2026US 2026/0304627 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996
- Flexible wearable computer479US 6,108,197 AViA, Inc. · 2000
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998