Component carrier, method for manufacturing a component carrier and component carrier assembly
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsEva-Maria KRENN, Gerhard SCHMID
Life of this patent
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Abstract
Provided are a component carrier and method for manufacturing, and a component carrier assembly. The component includes a flexible stack and at least two further stacks that each are electrically connected to the flexible stack by an electrically conductive paste. Each stack has a stacking direction and at least one lateral surface limiting the extension of the stack in a planar direction perpendicular to its stacking direction. At least one lateral surface of the flexible stack and at least one lateral surface of one of the at least two further stacks fact towards a same lateral side of the component carrier and are extending in different spatial planes.
Claims20
A component carrier comprising:
- a flexible stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure;
- a first further stack;
- and
- a second further stack;
- wherein:
- each of the first further stack and the second further stack comprises at least one respective electrically insulating layer structure and at least one respective electrically conductive layer structure;
- wherein each of the first further stack and the second further stack is electrically connected to the flexible stack by a respective electrical connection comprising electrically conductive paste,
- wherein each of the flexible stack, the first further stack, and the second further stack comprises a respective stacking direction and at least one respective lateral surface, wherein the at least one respective lateral surface limits an extension of the respective stack in a respective planar direction perpendicular to the respective stacking direction and extends in a respective spatial plane,
- wherein at least one respective lateral surface of the flexible stack and at least one respective lateral surface of one of the first further stack and the second further stack face towards a same lateral side of the component carrier, and extend in different respective spatial planes.
A method for manufacturing a component carrier, the method comprising at least:
- providing a flexible stack comprising at least one respective electrically insulating layer structure and at least one respective electrically conductive layer structure;
- providing a first further stack and a second further stack, each of the first further stack and the second further stack comprising at least one respective electrically insulating layer structure and at least one respective electrically conductive layer structure;
- electrically connecting each of the first further stack and the second further stack by a respective electrical connection comprising electrically conductive paste such that each of the first further stack and the second further stack is finally electrically connected to the flexible stack, wherein each of the flexible stack, the first further stack, and the second further stack comprises a respective stacking direction and at least one respective lateral surface, wherein the at least one respective lateral surface limits an extension of the respective stack in a respective planar direction perpendicular to the respective stacking direction and extends in a respective spatial plane;
- and
- arranging the flexible stack, the first further stack, and the second further stack based on a respective orientation of their respective lateral surfaces relatively to each other such that at least one respective lateral surface of the flexible stack and at least one respective lateral surface of the first further stack or the second further stack face towards a same lateral side of the component carrier and extend in different respective spatial planes.
Dependencies are inferred from the claim text.