H05K 3/361
Assembling flexible printed circuits with other printed circuits
Official title: {Assembling flexible printed circuits with other printed circuits}
H05K3/361 (Assembling flexible printed circuits with other printed circuits) appears on 2,909 US grants and 2,625 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,909
- Published applications
- 2,625
- Assignees
- 963
- Inventors
- 5,835
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 11 | 0 |
| 1978 | 7 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 8 | 0 |
| 1982 | 4 | 0 |
| 1983 | 7 | 0 |
| 1984 | 8 | 0 |
| 1985 | 10 | 0 |
| 1986 | 20 | 0 |
| 1987 | 33 | 0 |
| 1988 | 18 | 0 |
| 1989 | 32 | 0 |
| 1990 | 30 | 0 |
| 1991 | 46 | 0 |
| 1992 | 34 | 0 |
| 1993 | 37 | 0 |
| 1994 | 43 | 0 |
| 1995 | 40 | 0 |
| 1996 | 51 | 0 |
| 1997 | 52 | 0 |
| 1998 | 73 | 0 |
| 1999 | 75 | 0 |
| 2000 | 75 | 0 |
| 2001 | 81 | 52 |
| 2002 | 78 | 86 |
| 2003 | 91 | 84 |
| 2004 | 87 | 116 |
| 2005 | 75 | 127 |
| 2006 | 82 | 134 |
| 2007 | 84 | 139 |
| 2008 | 86 | 146 |
| 2009 | 87 | 110 |
| 2010 | 92 | 111 |
| 2011 | 103 | 88 |
| 2012 | 87 | 62 |
| 2013 | 64 | 61 |
| 2014 | 47 | 74 |
| 2015 | 71 | 70 |
| 2016 | 61 | 90 |
| 2017 | 70 | 95 |
| 2018 | 112 | 128 |
| 2019 | 111 | 106 |
| 2020 | 98 | 143 |
| 2021 | 108 | 129 |
| 2022 | 115 | 102 |
| 2023 | 97 | 97 |
| 2024 | 85 | 94 |
| 2025 | 74 | 48 |
| 2026 | 37 | 133 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Flexible interconnect circuits comprising welded connections25 Aug 2026US 12,720,679 B2CelLink Corporation
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Method of manufacture and use of a flexible computerized sensing device18 Aug 2026US 12,713,533 B2Velvetwire LLC
- FPC mounting module, electronic device, and mounting method11 Aug 2026US 12,707,582 B2Huawei Technologies Co., Ltd.
- Electrical contact arrangement for microfabricated ultrasonic transducer4 Aug 2026US 12,701,918 B2Bfly Operations, Inc.
- Component carrier, method for manufacturing a component carrier and component carrier assembly1 Oct 2026US 2026/0304627 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Thermal print head and method of manufacturing the same3 Sep 2026US 2026/0257492 A1Rohm Co., Ltd.
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
Most cited
By later US patents
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996
- Flexible wearable computer479US 6,108,197 AViA, Inc. · 2000
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997