Manufacturing method for long circuit board and long circuit board

A fabrication method for a long circuit board, comprising the following steps:

• material preparation:
• preparing m short copper-clad laminates, wherein each short copper-clad laminate comprises a front copper layer and a back copper layer on an upper surface and a lower surface thereof, and an intermediate insulating layer is disposed between the front copper layer and the back copper layer;
• hole making:
• stacking the plurality of short copper-clad laminates and drilling to form via holes on the short copper-clad laminates, wherein each via hole penetrates through the front copper layer, the back copper layer and the intermediate insulating layer;
• adhesive application:
• applying adhesive to both ends of all short copper-clad laminates to obtain Board A;
• or, applying adhesive to both ends of a part of the short copper-clad laminates to obtain Board A, and enabling the other short copper-clad laminates without adhesive applied to both ends to form Board B.;
• or, applying adhesive to one end of the short copper-clad laminate to obtain Board C;
• laminating joining:
• overlapping m short copper-clad laminates with pre-drilled holes end to end, wherein overlapping positions are bonded together with the adhesive at ends;
• via hole electroplating;
• and
• circuit fabricating.

A long circuit board, wherein the long circuit board is formed by overlapping and lapping m short circuit boards end to end, the short circuit board comprises a front circuit layer, a back circuit layer, and an intermediate insulating layer therebetween;

• the short circuit board is provided with a plurality of via holes, and each via hole penetrates through the front circuit layer, the back circuit layer, and the intermediate insulating layer;
• the short circuit board is a double-layer circuit board or a multi-layer circuit board, and adjacent short circuit boards are bonded together at an overlapping position, with at least two sandwiched copper layers at the overlapping position, which comprise a first copper layer on one short circuit board and a second copper layer on the adjacent short circuit board;
• or adjacent short circuit boards are bonded together at the overlapping position, with only one sandwiched copper layer at the overlapping position, wherein the copper layer is located on one of the short circuit board, and the adjacent short circuit board is bonded with the copper layer at the overlapping position through the intermediate insulating layer;
• or no copper layer is sandwiched in the overlapping position, and the two intermediate insulating layers are the overlapping position are bonded together.