H05K 3/363
By soldering
Official title: {by soldering}
H05K3/363 (By soldering) appears on 815 US grants and 748 published applications in this corpus.
Search patents in H05K- Granted patents
- 815
- Published applications
- 748
- Assignees
- 393
- Inventors
- 1,857
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 5 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 4 | 0 |
| 1991 | 20 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 10 | 0 |
| 1995 | 11 | 0 |
| 1996 | 10 | 0 |
| 1997 | 19 | 0 |
| 1998 | 18 | 0 |
| 1999 | 24 | 0 |
| 2000 | 23 | 0 |
| 2001 | 29 | 18 |
| 2002 | 26 | 19 |
| 2003 | 27 | 24 |
| 2004 | 19 | 40 |
| 2005 | 16 | 38 |
| 2006 | 20 | 41 |
| 2007 | 21 | 41 |
| 2008 | 25 | 43 |
| 2009 | 29 | 28 |
| 2010 | 25 | 24 |
| 2011 | 27 | 22 |
| 2012 | 21 | 18 |
| 2013 | 15 | 19 |
| 2014 | 20 | 15 |
| 2015 | 14 | 21 |
| 2016 | 11 | 29 |
| 2017 | 20 | 32 |
| 2018 | 40 | 36 |
| 2019 | 33 | 23 |
| 2020 | 25 | 34 |
| 2021 | 26 | 36 |
| 2022 | 32 | 37 |
| 2023 | 26 | 35 |
| 2024 | 31 | 41 |
| 2025 | 34 | 22 |
| 2026 | 14 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible interconnect circuits comprising welded connections25 Aug 2026US 12,720,679 B2CelLink Corporation
- Display module and display apparatus with grounding structure28 Jul 2026US 12,696,377 B2Xiamen Tianma Microelectronics Co., Ltd.
- Connecting arrangement30 Jun 2026US 12,672,234 B2Robert Bosch GmbH
- Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus16 Jun 2026US 12,659,565 B2Canon Kabushiki Kaisha
- Ultrasonically bonding a flexible electronic circuit element having a plurality of vias9 Jun 2026US 12,651,880 B2St. Jude Medical, Cardiology Division, Inc.
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
- Connection structure of wire and circuit board and temperature measurement unit23 Jul 2026US 2026/0213438 A1Autonetworks Technologies, Ltd.
- Mechanical bonding between flex circuits16 Jul 2026US 2026/0206139 A1Manaflex, LLC
- Sensing Assembly and Battery Module2 Jul 2026US 2026/0188875 A1SK On Co., Ltd.
- Wiring structure of electronic components and connection method of electronic components2 Jul 2026US 2026/0190238 A1Keita Smart Future-Creations Inc.
Most cited
By later US patents
- Integrated circuit package and method of fabrication317US 6,028,365 AMicron Technology, Inc. · 2000
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Semiconductor stacked device226US 5,198,888 AHitachi, Ltd. · 1993
- Pad array carrier IC device using flexible tape207US 5,045,921 AMotorola, Inc. · 1991