Connection structure of wire and circuit board and temperature measurement unit
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorNobuyuki MATSUMURA
Life of this patent
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Abstract
A connection structure 1 of a wire 20 and a circuit board 10 includes the wire 20 including a core wire 21 and an insulation coating 22 covering an outer periphery of the core wire 21, the circuit board 10 including a wire land to be connected to the core wire 21 by soldering, and a rigid board 30 to be disposed to overlap the circuit board 10 in a thickness direction of the circuit board 10. The rigid board 30 includes an accommodating portion 33 penetrating in the thickness direction and open in a direction orthogonal to the thickness direction. The accommodating portion 33 includes a core wire accommodating portion 35 for accommodating the core wire 21 and is disposed to overlap the wire land in the thickness direction.
Claims7
A connection structure of a wire and a circuit board, comprising:
- a wire including a core wire and an insulation coating covering an outer periphery of the core wire;
- a circuit board including a wire land to be connected to the core wire by soldering;
- and
- a rigid board to be disposed to overlap the circuit board in a thickness direction of the circuit board,
- the rigid board including an accommodating portion penetrating in the thickness direction and open in a direction orthogonal to the thickness direction, and
- the accommodating portion including a core wire accommodating portion for accommodating the core wire, the accommodating portion being disposed to overlap the wire land in the thickness direction.
Dependencies are inferred from the claim text.