H05K 3/365
By abutting, i.e. without alloying process
Official title: {by abutting, i.e. without alloying process}
H05K3/365 (By abutting, i.e. without alloying process) appears on 496 US grants and 310 published applications in this corpus.
Search patents in H05K- Granted patents
- 496
- Published applications
- 310
- Assignees
- 301
- Inventors
- 1,022
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 12 | 0 |
| 1988 | 6 | 0 |
| 1989 | 12 | 0 |
| 1990 | 11 | 0 |
| 1991 | 9 | 0 |
| 1992 | 7 | 0 |
| 1993 | 16 | 0 |
| 1994 | 10 | 0 |
| 1995 | 7 | 0 |
| 1996 | 13 | 0 |
| 1997 | 8 | 0 |
| 1998 | 15 | 0 |
| 1999 | 17 | 0 |
| 2000 | 17 | 0 |
| 2001 | 13 | 5 |
| 2002 | 14 | 11 |
| 2003 | 16 | 13 |
| 2004 | 16 | 9 |
| 2005 | 15 | 16 |
| 2006 | 11 | 22 |
| 2007 | 14 | 18 |
| 2008 | 17 | 15 |
| 2009 | 15 | 15 |
| 2010 | 10 | 9 |
| 2011 | 8 | 11 |
| 2012 | 6 | 3 |
| 2013 | 6 | 13 |
| 2014 | 3 | 7 |
| 2015 | 9 | 6 |
| 2016 | 12 | 5 |
| 2017 | 6 | 9 |
| 2018 | 10 | 14 |
| 2019 | 12 | 14 |
| 2020 | 13 | 18 |
| 2021 | 11 | 19 |
| 2022 | 17 | 16 |
| 2023 | 12 | 18 |
| 2024 | 11 | 13 |
| 2025 | 14 | 5 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Service board and communication device9 Jun 2026US 12,650,566 B2Huawei Technologies Co., Ltd.
- Display module and electronic device including the same12 May 2026US 12,628,278 B2Samsung Electronics Co., Ltd.
- Printed circuit board assembly for an aircraft solid state power controller17 Mar 2026US 12,581,594 B2Hs Elektronik Systeme GmbH
- Interconnection of printed circuit boards with nanowires11 Nov 2025US 12,471,203 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Structural locating sensors for a sensor module using a printed circuit board assembly14 Oct 2025US 12,442,701 B2BRP Megatech Industries Inc.
- Electronic device comprising connector13 Aug 2026US 2026/0237927 A1Samsung Electronics Co., Ltd.
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Electrical connection structure and electronic device16 Apr 2026US 2026/0106410 A1Honor Device Co., Ltd.
- Electronic device5 Mar 2026US 2026/0068052 A1Samsung Display Co., Ltd.
- Compression defined broaching mounts for a compression-attached memory module (camm) connector platform26 Feb 2026US 2026/0059665 A1Advanced Micro Devices, Inc.
Most cited
By later US patents
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996
- Thin interface pellicle for dense arrays of electrical interconnects187US 5,207,585 AInternational Business Machines Corporation · 1993
- Flexible touchpad sensor grid for conforming to arcuate surfaces183US 6,680,731 B2Cirque Corporation · 2004
- Gimbal flexure and electrical interconnect assembly165US 5,491,597 AHutchinson Technology Incorporated · 1996
- Connection of trace circuitry in a computer disk drive system163US 7,059,868 B1Western Digital (Fremont), LLC · 2006