Thin interface pellicle for dense arrays of electrical interconnects

An apparatus for providing electrical contact between an array of first contacts forming a first rigid probe adapted to transfer force and a corresponding array of raised conductive bumps on an electrical device supported to withstand said force, said array of raised conductive bumps being substantially deformed under said transfer force, comprising:

• a flexible membrane having an upper surface and a lower surface, and
• an array of electrodes formed in said flexible membrane and extending above said upper surface and below said lower surface along respective longitudinal axes of said electrodes,
• each said electrode having a first end extending above said upper surface and a second end extending below said lower surface and a first predetermined length along said respective longitudinal axis,
• said first end of said electrode having a plurality of first raised portions for penetrating the surface of said conductive bump to create a plurality of non-contiguous sidewalls having a maximum predetermined depth,
• said first end of said electrode having a second recessed portion adjacent and between said first raised portions to limit the penetration of any of said plurality of said first raised portions into the surface of said conductive bump,
• said flexible membrane having a thickness to form at times a curved upper and lower surface having a minimum radius of curvature in localized regions and an elasticity to provide for a predetermined elastic deformation of said flexible membrane in localized regions to permit said electrodes to move independently.