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AssigneeMeta Platforms Technologies, LLC
InventorsBrian Toleno, Michael Nikkhoo, Arman Boromand, Sheng Ye, Andrew John Ouderkirk, Jonathan Robert Peterson
Estimating the term…
A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.
An interposer comprising:
A tri-layer structure comprising:
A stack-PCB architecture comprising:
Dependencies are inferred from the claim text.