Electronic apparatus including flexible printed circuit board

A flexible printed circuit board comprising:

• a first wire including a first board surface and a second board surface that is opposite to the first board surface, in which a first signal circuit is formed along a length direction;
• a second wire including a third board surface and a fourth board surface that is opposite to the third board surface and connected to the first wire through a bonding area;
• a bonding sheet placed in the bonding area and with each of both surfaces bonded to the first board surface and the third board surface;
• a signal via penetrating the first wire and the second wire and configured to electrically connect the first signal circuit to the second signal circuit, in a state in which the second board surface is viewed,
• a first cover placed on the second board surface of the first wire to cover the bonding area;
• and
• wherein a second cover placed on the fourth board surface of the second wire to cover the bonding area.

A electronic device comprising:

• a first housing;
• a second housing connected to the first housing, the second housing being partially moveable in a moving direction;
• a display supported by the first housing and the second housing and configured to change between a first state and a second state, an area of the display being visually exposed to an outside according to a relative movement of the first housing and second housing, the first state being a state in which the area of the display is visually exposed at a minimum, the second state being a state in which the area of the display is visually exposed at a maximum;
• and a flexible printed circuit board of which both ends are placed respectively in the first housing and the second housing, and
• wherein the flexible printed circuit board comprises:
• a first wire comprising a first signal circuit formed along a first length direction;
• a second wire comprising a second signal circuit formed along a second length direction, and connected to the first wire through a bonding area, a bonding sheet placed in the bonding area and with each of both surfaces bonded to the first wire and the second wire;
• a first cover, of which at least a portion is placed in the bonding area, placed on a surface of the first wire to be opposed to the bonding sheet;
• a second cover, of which at least a portion is placed in the bonding area, placed on a surface of the second wire to be opposed to the bonding sheet;
• one or more signal vias penetrating the first wire and the second wire and configured to connect the first signal circuit to the second signal circuit;
• and
• a plurality of dummy vias connected to penetrate the first cover and the second cover.