H05K 3/368
Parallel to each other
Official title: {parallel to each other (H05K3/361 takes precedence)}
H05K3/368 (Parallel to each other) appears on 1,324 US grants and 1,090 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,324
- Published applications
- 1,090
- Assignees
- 669
- Inventors
- 3,068
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 7 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 10 | 0 |
| 1986 | 9 | 0 |
| 1987 | 13 | 0 |
| 1988 | 6 | 0 |
| 1989 | 9 | 0 |
| 1990 | 7 | 0 |
| 1991 | 25 | 0 |
| 1992 | 24 | 0 |
| 1993 | 12 | 0 |
| 1994 | 21 | 0 |
| 1995 | 24 | 0 |
| 1996 | 35 | 0 |
| 1997 | 23 | 0 |
| 1998 | 44 | 0 |
| 1999 | 44 | 0 |
| 2000 | 38 | 0 |
| 2001 | 47 | 32 |
| 2002 | 62 | 70 |
| 2003 | 49 | 44 |
| 2004 | 54 | 38 |
| 2005 | 28 | 33 |
| 2006 | 28 | 24 |
| 2007 | 24 | 28 |
| 2008 | 18 | 22 |
| 2009 | 17 | 30 |
| 2010 | 16 | 31 |
| 2011 | 20 | 24 |
| 2012 | 20 | 24 |
| 2013 | 23 | 39 |
| 2014 | 14 | 37 |
| 2015 | 35 | 46 |
| 2016 | 37 | 36 |
| 2017 | 32 | 38 |
| 2018 | 43 | 51 |
| 2019 | 52 | 59 |
| 2020 | 49 | 53 |
| 2021 | 45 | 59 |
| 2022 | 63 | 63 |
| 2023 | 37 | 62 |
| 2024 | 54 | 66 |
| 2025 | 43 | 39 |
| 2026 | 27 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermoplastic interposer15 Sep 2026US 12,739,965 B2Meta Platforms Technologies, LLC
- Field device and method for compact arrangement of electronic assemblies of an electronic circuit18 Aug 2026US 12,713,532 B2VEGA Grieshaber KG
- Circuit board assembly with bonded conductive posts and method of manufacturing circuit board assembly11 Aug 2026US 12,707,558 B2Fuji Electric Co., Ltd.
- Stackable memory module with double-sided compression contact pads11 Aug 2026US 12,707,566 B2Intel Corporation
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Adhesive and method for manufacturing circuit connection structure8 Oct 2026US 2026/0313803 A1
- Methods, systems, and apparatuses for manufacturing wearable ring devices1 Oct 2026US 2026/0304644 A1NaturalCycles Nordic AB
- Ball grid array package24 Sep 2026US 2026/0292989 A1LG Innotek Co., Ltd.
- Method for manufacturing circuit connection structure, adhesive film for circuit connection, and circuit connection structure24 Sep 2026US 2026/0292990 A1
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999