H05K 3/007
Manufacture or processing of a substrate for a printed circuit board supported
Official title: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
H05K3/007 (Manufacture or processing of a substrate for a printed circuit board supported) appears on 589 US grants and 735 published applications in this corpus.
Search patents in H05K- Granted patents
- 589
- Published applications
- 735
- Assignees
- 293
- Inventors
- 1,539
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 13 | 7 |
| 2002 | 7 | 4 |
| 2003 | 3 | 5 |
| 2004 | 5 | 11 |
| 2005 | 4 | 11 |
| 2006 | 3 | 19 |
| 2007 | 8 | 21 |
| 2008 | 13 | 21 |
| 2009 | 9 | 26 |
| 2010 | 14 | 23 |
| 2011 | 14 | 25 |
| 2012 | 16 | 17 |
| 2013 | 18 | 21 |
| 2014 | 17 | 46 |
| 2015 | 32 | 70 |
| 2016 | 44 | 68 |
| 2017 | 46 | 60 |
| 2018 | 50 | 52 |
| 2019 | 49 | 40 |
| 2020 | 48 | 45 |
| 2021 | 37 | 35 |
| 2022 | 34 | 34 |
| 2023 | 22 | 21 |
| 2024 | 20 | 25 |
| 2025 | 16 | 15 |
| 2026 | 15 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Wiring substrate, method of trimming same, and multi-layered wiring board4 Aug 2026US 12,701,662 B2Mitsui Kinzoku Company, Limited
- Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof14 Jul 2026US 12,684,704 B2Sanmina Corporation
- Base board floating arm16 Jun 2026US 12,660,092 B2Sheng Chuan Technology Co., Ltd.
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads10 Sep 2026US 2026/0271754 A1Advanced Semiconductor Engineering, Inc.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Polyimide film, laminated body, flexible electronic device, and method for producing flexible electronic device30 Jul 2026US 2026/0217927 A1Toyobo Co., Ltd.
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate23 Jul 2026US 2026/0214810 A1Nantong Access Semiconductor Co., Ltd.
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- Method for manufacturing a stretchable electronic device167US 8,207,473 B2Imec · 2012
- Method for manufacturing polyimide multilayer wiring substrate161US 5,322,593 ANEC Corporation · 1994
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993