Polyimide film, laminated body, flexible electronic device, and method for producing flexible electronic device

Abstract

The present invention relates to a polyimide film, which includes a polyimide obtained through imidization of a polyamic acid that is a copolymerization reaction product of at least a carboxylic acid, a diamine, and a silsesquioxane derivative, and has a coefficient of static friction of 2.0 or less. In addition to this, the present invention relates to a laminated body including the polyimide film and an inorganic substrate. The present invention also relates to a method for producing a flexible electronic device, which includes a step of forming an electronic device on a polyimide film surface of the laminated body and a step of peeling off the inorganic substrate. The present invention also relates to a flexible electronic device including the polyimide film and an electronic device formed on the polyimide film.

Dependencies are inferred from the claim text.