H05K 3/44
Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Official title: Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)}
H05K3/44 (Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits) appears on 599 US grants and 510 published applications in this corpus.
Search patents in H05K- Granted patents
- 599
- Published applications
- 510
- Assignees
- 273
- Inventors
- 1,211
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 7 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 8 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 9 | 0 |
| 1991 | 6 | 0 |
| 1992 | 11 | 0 |
| 1993 | 11 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 11 | 0 |
| 1998 | 17 | 0 |
| 1999 | 14 | 0 |
| 2000 | 7 | 0 |
| 2001 | 24 | 11 |
| 2002 | 27 | 21 |
| 2003 | 24 | 37 |
| 2004 | 30 | 26 |
| 2005 | 20 | 26 |
| 2006 | 21 | 22 |
| 2007 | 15 | 25 |
| 2008 | 15 | 28 |
| 2009 | 15 | 40 |
| 2010 | 24 | 19 |
| 2011 | 20 | 26 |
| 2012 | 30 | 26 |
| 2013 | 15 | 18 |
| 2014 | 11 | 18 |
| 2015 | 11 | 25 |
| 2016 | 18 | 22 |
| 2017 | 16 | 15 |
| 2018 | 11 | 14 |
| 2019 | 21 | 17 |
| 2020 | 15 | 12 |
| 2021 | 7 | 10 |
| 2022 | 12 | 13 |
| 2023 | 4 | 10 |
| 2024 | 12 | 18 |
| 2025 | 8 | 5 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Method for producing wiring circuit board and wiring circuit board21 Apr 2026US 12,610,459 B2Nitto Denko Corporation
- Wiring circuit board7 Apr 2026US 12,598,698 B2Nitto Denko Corporation
- Wiring circuit board7 Apr 2026US 12,598,703 B2Nitto Denko Corporation
- Battery apparatus and manufacturing method therefor17 Mar 2026US 12,580,234 B2LG Energy Solution, Ltd.
- Systems and methods for high-stiffness substrate integration in semiconductor packages16 Jul 2026US 2026/0206130 A1Avago Technologies International Sales Pte. Limited
- Method for producing opening detection sheet, opening detection sheet, and packaging material4 Jun 2026US 2026/0152334 A1Uacj Corporation
- Composite copper foil and manufacturing method thereof7 May 2026US 2026/0124821 A1Nan Ya Plastics Corporation
- Cooling systems and methods12 Feb 2026US 2026/0046999 A1EvansWerks, LLC
- Hybrid pcb with planar antenna12 Feb 2026US 2026/0047000 A1Signify Holding B. V.
Most cited
By later US patents
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Metal base package for a semiconductor device195US 5,866,942 ANEC Corporation · 1999
- Methods of fabrication of coaxial vias and magnetic devices167US 5,898,991 AInternational Business Machines Corporation · 1999
- Encapsulated circuitized power core alignment and lamination149US 5,229,550 AInternational Business Machines Corporation · 1993
- Two signal one power plane circuit board145US 6,204,453 B1International Business Machines Corporation · 2001