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US 5,229,550 AGranted
Encapsulated circuitized power core alignment and lamination
AssigneeInternational Business Machines Corporation
InventorsPerminder S. Bindra, Dennis A. Canfield, Voya Rista Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas
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Abstract
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
Claims7
A high performance printed circuit board comprising:
- at least two circuitized power cores, each of said circuitized power cores including a power plane coated on opposite sides thereof with organic dielectric material and having signal lines and lands located on external surfaces of said organic dielectric material, each of said circuitized power cores further including a conductive via formed therein and extending between said external surfaces of said organic dielectric material, said conductive vias being oriented within said circuit board in aligned manner adjacent each other;
- a layer of organic dielectric material located on one of said external surfaces of organic dielectric material of one of said circuitized power cores for covering said signal lines thereon and including an opening therein to expose said conductive via within said circuitized power core, said layer of organic dielectric material being positioned between adjacent surfaces of said organic dielectric material coated on said power planes of said circuitized power cores;
- and
- a quantity of solder joining metal located within said aligned conductive vias of said circuitized power cores for providing electrical coupling therebetween, said solder also extending through said opening within said layer of organic dielectric material located on said one of said external surfaces of said organic dielectric material.
1 more element
Dependencies are inferred from the claim text.