H05K 3/445
Having insulated holes or insulated via connections through the metal core
Official title: {having insulated holes or insulated via connections through the metal core}
H05K3/445 (Having insulated holes or insulated via connections through the metal core) appears on 337 US grants and 273 published applications in this corpus.
Search patents in H05K- Granted patents
- 337
- Published applications
- 273
- Assignees
- 161
- Inventors
- 656
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 3 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 13 | 10 |
| 2002 | 21 | 13 |
| 2003 | 14 | 21 |
| 2004 | 21 | 17 |
| 2005 | 10 | 10 |
| 2006 | 11 | 15 |
| 2007 | 7 | 16 |
| 2008 | 10 | 15 |
| 2009 | 8 | 20 |
| 2010 | 14 | 12 |
| 2011 | 10 | 22 |
| 2012 | 19 | 22 |
| 2013 | 10 | 11 |
| 2014 | 7 | 9 |
| 2015 | 7 | 12 |
| 2016 | 10 | 13 |
| 2017 | 8 | 4 |
| 2018 | 3 | 5 |
| 2019 | 7 | 7 |
| 2020 | 7 | 4 |
| 2021 | 4 | 2 |
| 2022 | 3 | 4 |
| 2023 | 1 | 2 |
| 2024 | 6 | 5 |
| 2025 | 1 | 1 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Battery apparatus and manufacturing method therefor17 Mar 2026US 12,580,234 B2LG Energy Solution, Ltd.
- Circuit board and manufacturing method thereof11 Mar 2025US 12,250,769 B2
- Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board8 Oct 2024US 12,114,438 B2Nitto Denko Corporation
- Through-hole electrode substrate3 Sep 2024US 12,080,637 B2Dai Nippon Printing Co.Ltd.
- Systems and methods for high-stiffness substrate integration in semiconductor packages16 Jul 2026US 2026/0206130 A1Avago Technologies International Sales Pte. Limited
- Plated through-hole structures and method for the manufacture thereof3 Apr 2025US 2025/0113446 A1
- Through-hole electrode substrate5 Dec 2024US 2024/0404934 A1Dai Nippon Printing Co.Ltd.
- Interconnect Circuit Methods And Devices15 Aug 2024US 2024/0276632 A1CelLink Corporation
- Circuit board and manufacturing method thereof15 Aug 2024US 2024/0276650 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Metal base package for a semiconductor device195US 5,866,942 ANEC Corporation · 1999
- Methods of fabrication of coaxial vias and magnetic devices167US 5,898,991 AInternational Business Machines Corporation · 1999
- Encapsulated circuitized power core alignment and lamination149US 5,229,550 AInternational Business Machines Corporation · 1993
- Two signal one power plane circuit board145US 6,204,453 B1International Business Machines Corporation · 2001