Plated through-hole structures and method for the manufacture thereof

A method for forming a plated through-hole structure, the method comprising:

• filling a first through-hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/° C., wherein
• the first through-hole has
• a first opening at a first side of the substrate,
• a second opening at a second, opposite side of the substrate, and
• an interior surface defining the first through-hole and extending from the first opening to the second opening,
• wherein the composition is disposed on the interior surface of the first through-hole from the first opening to the second opening;
• forming a second through-hole in the first through-hole comprising the composition, wherein the second through-hole has
• a diameter less than a diameter of the first through-hole,
• an opening at the first side of the substrate,
• an opening at the second, opposite side of the substrate, and
• an interior surface defining the second through-hole and extending from the opening at the first side of the substrate to the opening at the second side of the substrate;
• and
• plating the interior surface of the second through-hole to provide the plated through-hole structure.