H05K 3/0073
Masks not provided for in groups h05k3/02 - h05k3/46
Official title: {Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces}
H05K3/0073 (Masks not provided for in groups h05k3/02 - h05k3/46) appears on 1,027 US grants and 652 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,027
- Published applications
- 652
- Assignees
- 424
- Inventors
- 2,066
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 16 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 15 | 0 |
| 1982 | 13 | 0 |
| 1983 | 17 | 0 |
| 1984 | 16 | 0 |
| 1985 | 33 | 0 |
| 1986 | 26 | 0 |
| 1987 | 34 | 0 |
| 1988 | 26 | 0 |
| 1989 | 23 | 0 |
| 1990 | 30 | 0 |
| 1991 | 31 | 0 |
| 1992 | 30 | 0 |
| 1993 | 31 | 0 |
| 1994 | 28 | 0 |
| 1995 | 39 | 0 |
| 1996 | 24 | 0 |
| 1997 | 24 | 0 |
| 1998 | 25 | 0 |
| 1999 | 25 | 0 |
| 2000 | 33 | 0 |
| 2001 | 30 | 14 |
| 2002 | 33 | 29 |
| 2003 | 44 | 43 |
| 2004 | 36 | 30 |
| 2005 | 17 | 39 |
| 2006 | 22 | 26 |
| 2007 | 15 | 23 |
| 2008 | 10 | 40 |
| 2009 | 15 | 43 |
| 2010 | 14 | 18 |
| 2011 | 18 | 17 |
| 2012 | 17 | 12 |
| 2013 | 13 | 18 |
| 2014 | 15 | 25 |
| 2015 | 17 | 25 |
| 2016 | 20 | 25 |
| 2017 | 27 | 18 |
| 2018 | 18 | 19 |
| 2019 | 13 | 12 |
| 2020 | 19 | 13 |
| 2021 | 7 | 16 |
| 2022 | 14 | 10 |
| 2023 | 9 | 13 |
| 2024 | 12 | 13 |
| 2025 | 11 | 11 |
| 2026 | 8 | 100 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Reusable composite stencil for spray processes14 Apr 2026US 12,600,159 B2Intel Corporation
- Apparatus and method for manufacturing power module7 Apr 2026US 12,598,704 B2Hyundai Mobis Co., Ltd.
- Photopolymer for anti-yellowing and anti-thermal cracking applications24 Mar 2026US 12,583,958 B2Nano and Advanced Materials Institute Limited
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Composition for photoresist removal and method for removing photoresist16 Jul 2026US 2026/0202749 A1Mitsubishi Gas Chemical Company, Inc.
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Method of forming articles including waveguides via capillary micromolding and microtransfer molding512US 6,355,198 B1President and Fellows of Harvard College · 2002
- Ablation-transfer imaging/recording243US 5,171,650 AGraphics Technology International Inc. · 1992
- Non-systolic time delay and integration printing194US 6,061,075 ATexas Instruments Incorporated · 2000
- Ablation-transfer imaging/recording159US 5,256,506 AGraphics Technology International Inc. · 1993
- Excimer laser patterning of a novel resist114US 4,780,177 AGeneral Electric Company · 1988