H05K 3/0079
Characterised by the method of application or removal of the mask
Official title: {characterised by the method of application or removal of the mask (H05K3/0091 takes precedence)}
H05K3/0079 (Characterised by the method of application or removal of the mask) appears on 298 US grants and 165 published applications in this corpus.
Search patents in H05K- Granted patents
- 298
- Published applications
- 165
- Assignees
- 144
- Inventors
- 641
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 9 | 0 |
| 1988 | 11 | 0 |
| 1989 | 10 | 0 |
| 1990 | 15 | 0 |
| 1991 | 10 | 0 |
| 1992 | 11 | 0 |
| 1993 | 11 | 0 |
| 1994 | 11 | 0 |
| 1995 | 10 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 10 | 0 |
| 2001 | 7 | 2 |
| 2002 | 6 | 1 |
| 2003 | 5 | 14 |
| 2004 | 9 | 12 |
| 2005 | 7 | 9 |
| 2006 | 2 | 7 |
| 2007 | 3 | 6 |
| 2008 | 2 | 10 |
| 2009 | 4 | 12 |
| 2010 | 3 | 4 |
| 2011 | 4 | 2 |
| 2012 | 3 | 5 |
| 2013 | 6 | 4 |
| 2014 | 5 | 9 |
| 2015 | 5 | 12 |
| 2016 | 8 | 10 |
| 2017 | 12 | 7 |
| 2018 | 7 | 10 |
| 2019 | 5 | 2 |
| 2020 | 9 | 5 |
| 2021 | 1 | 5 |
| 2022 | 4 | 4 |
| 2023 | 3 | 1 |
| 2024 | 5 | 3 |
| 2025 | 5 | 7 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- RF cover layer23 Dec 2025US 12,507,347 B2Raytheon Company
- Method of manufacturing conductive pattern, touch sensor, electromagnetic wave shield, antenna, wiring board, conductive heating element, and structure23 Sep 2025US 12,426,166 B2FUJIFILM Corporation
- Methods to fill through-holes of a substrate with metal paste24 Jun 2025US 12,342,470 B2Reophotonics, Ltd.
- Methods for producing an etch resist pattern on a metallic surface8 Apr 2025US 12,270,111 B2Kateeva, Inc.
- Composition for photoresist removal and method for removing photoresist16 Jul 2026US 2026/0202749 A1Mitsubishi Gas Chemical Company, Inc.
- Method of forming a pattern for microelectronic devices7 May 2026US 2026/0129766 A1Oregon State University
- Photoresist stripper and method for using the same18 Dec 2025US 2025/0382553 A1Nan Ya Plastics Corporation
- Pattern formation method and pattern formation structure6 Nov 2025US 2025/0344324 A1Resonac Corporation
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Method of forming articles including waveguides via capillary micromolding and microtransfer molding512US 6,355,198 B1President and Fellows of Harvard College · 2002
- Ablation-transfer imaging/recording243US 5,171,650 AGraphics Technology International Inc. · 1992
- Ablation-transfer imaging/recording159US 5,256,506 AGraphics Technology International Inc. · 1993
- Thermally transferable layers of radiation sensitive epoxy resins used to prepare protective coatings and relief images91US 4,624,912 ACiba-Geigy Corporation · 1986
- Molded waveguides78US 8,012,382 B2President and Fellows of Harvard College · 2011