Methods to fill through-holes of a substrate with metal paste

A method for filling through-holes of a substrate with a metal paste, the method comprising:

• securing a first lamination foil onto a first surface of the substrate;
• securing a second lamination foil onto a second surface of the substrate;
• generating with a laser beam a first plurality of holes in the first lamination foil, respective locations of the first plurality of holes being aligned with the through-holes of the substrate;
• generating with the laser beam a second plurality of holes in the second lamination foil, respective locations of the second plurality of holes being aligned with the through-holes of the substrate;
• applying metal paste into the through-holes through the first plurality of holes in the first lamination foil, wherein applying metal paste into the through-holes through the first plurality of holes comprises using a squeegee or a knife to push the metal paste into the through-holes;
• sealing the first plurality of holes with a backing member;
• using the squeegee or knife to scrape off the metal paste that protrudes out of the second plurality of holes, while the backing member seals the first plurality of holes;
• and
• removing the first and second lamination foils from the substrate.