H05K 3/0076
Characterised by the composition of the mask
Official title: {characterised by the composition of the mask}
H05K3/0076 (Characterised by the composition of the mask) appears on 178 US grants and 179 published applications in this corpus.
Search patents in H05K- Granted patents
- 178
- Published applications
- 179
- Assignees
- 124
- Inventors
- 469
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 6 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 8 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 12 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 2 |
| 2002 | 5 | 1 |
| 2003 | 6 | 5 |
| 2004 | 4 | 2 |
| 2005 | 0 | 2 |
| 2006 | 1 | 3 |
| 2007 | 0 | 4 |
| 2008 | 2 | 7 |
| 2009 | 3 | 6 |
| 2010 | 2 | 3 |
| 2011 | 2 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 3 |
| 2014 | 1 | 7 |
| 2015 | 5 | 8 |
| 2016 | 6 | 5 |
| 2017 | 8 | 2 |
| 2018 | 1 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 3 |
| 2021 | 2 | 3 |
| 2022 | 0 | 2 |
| 2023 | 1 | 5 |
| 2024 | 2 | 2 |
| 2025 | 3 | 4 |
| 2026 | 3 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Photopolymer for anti-yellowing and anti-thermal cracking applications24 Mar 2026US 12,583,958 B2Nano and Advanced Materials Institute Limited
- Method of forming an electronic device on a flexible substrate24 Mar 2026US 12,585,183 B2Fundació Institut Catalá De NanociéNcia I Nanotecnologia
- Polypeptide, photoresist composition including the same, and method of forming pattern using the same14 Oct 2025US 12,441,769 B2Samsung Electronics Co., Ltd.
- Photosensitive composition and photoresist dry film made therefrom30 Sep 2025US 12,429,769 B2Dupont Electronics, Inc.
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
- Local-Bias Adaptive Drive for Timing Stabilization in Pipelined Mixed-Precision Processing Elements16 Jul 2026US 2026/0203017 A1
Most cited
By later US patents
- Etch-resistant jet ink and process99US 5,270,368 AVideojet Systems International, Inc. · 1993
- Infra-red sensitive aqueous wash-off photoimaging element56US 5,512,418 AE. I. Du Pont de Nemours and Company · 1996
- Epoxy resin coating compositions for printed circuit boards36US 4,510,276 AKollmorgen Technologies Corporation · 1985
- Electroless plating-resisting ink composition30US 5,158,989 ASomar Corporation · 1992
- Flowable compositions and use in filling vias and plated through-holes26US 6,090,474 AInternational Business Machines Corporation · 2000