Flowable compositions and use in filling vias and plated through-holes
AssigneeInternational Business Machines Corporation
InventorsGary Alan Johansson, Konstantinos I. Papathomas
Life of this patent
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Abstract
A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.
Claims6
A printed circuit board or card having plated through-holes wherein plated through-holes are further plated with a layer of metal, and wherein the through-holes are filled with a photocured polymerized polymer composition comprising a ceramic filler in an amount of more than 0 or 80% by weight.
Dependencies are inferred from the claim text.