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US 12,429,769 B2Granted
Photosensitive composition and photoresist dry film made therefrom
AssigneeDupont Electronics, Inc.
InventorsTsung-Han Tsai, Liyen Lin
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Abstract
The present invention provides photosensitive compositions comprising: (a) a novel polymeric binder; (b) a polymerizable compound; (c) a photoinitiator; and (d) a photosensitizer. The photosensitive compositions having improved developing and/or stripping performance with comparable adhesion and resolution.
Claims10
A photosensitive composition, comprising:
- (a) a polymeric binder consisting of:
- 10-70% by weight of a structural unit represented by Formula 1,
- 15-35% by weight of a structural unit represented by Formula 2, and
- 5-60% by weight of at least one structural unit represented by Formula 3,
- wherein
- R1, R3, and R4 each independently is H or CH3;
- R2 is C1-C3 alkyl, C1-C3 alkoxy, —NH2, or halogen;
- m is an integer of 0-5, and when m is 2-5, the multiple R2 groups may be the same or different;
- R5 is C1-C5, alkyl, benzyl, or C(O)CH2C(O)CH3;
- and
- n is an integer of 0-12;
- wherein the at least one structural unit represented by Formula 3 comprises a structural unit represented by Formula 3 where n is other than 0;
- the weight ratio of each structural unit is based on the total weight of the polymerizable precursors for constituting the polymeric binder;
- (b) a polymerizable compound;
- (c) a photoinitiator;
- and
- (d) a photosensitizer.
14 more elements
Dependencies are inferred from the claim text.