Selective removal of adhesive from coverlay for printed circuit board insulation

A circuit board system comprising:

• a printed circuit board (PCB) having a first side and a second side opposite the first side, wherein a plurality of plated through holes (PTHs) are defined through the PCB from the first side to the second side;
• a respective pad is defined at each end of each PTH of the plurality of PTHs, wherein the PCB includes circuit traces electrically interconnecting among the plurality of PTHs for forming PCB circuitry;
• a coverlay adhered with an adhesive layer to the first side of the PCB for insulating voltages among the plurality of PTHs;
• and
• a plurality of pin contacts, each pin contact of the plurality of pin contacts extending through the coverlay and a through bore of a respective one of the PTHs of the plurality of PTHs, wherein none of the adhesive layer extends into the through bore,
• wherein each through bore is defined along a respective bore axis, wherein the coverlay includes an overhang in each of the plurality of PTHs wherein the coverlay extends radially inward with respect to each bore axis toward the respective pin contact beyond the respective pad, wherein the overhang defines a void in the adhesive layer axially between the PCB and the coverlay relative to the respective bore axis.