H05K 3/0094
Filling or covering plated through-holes or blind plated vias
Official title: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement}
H05K3/0094 (Filling or covering plated through-holes or blind plated vias) appears on 536 US grants and 511 published applications in this corpus.
Search patents in H05K- Granted patents
- 536
- Published applications
- 511
- Assignees
- 297
- Inventors
- 1,309
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 8 | 0 |
| 1989 | 9 | 0 |
| 1990 | 1 | 0 |
| 1991 | 13 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 14 | 0 |
| 1996 | 12 | 0 |
| 1997 | 11 | 0 |
| 1998 | 23 | 0 |
| 1999 | 20 | 0 |
| 2000 | 31 | 0 |
| 2001 | 29 | 11 |
| 2002 | 17 | 21 |
| 2003 | 23 | 29 |
| 2004 | 20 | 16 |
| 2005 | 12 | 9 |
| 2006 | 9 | 8 |
| 2007 | 4 | 8 |
| 2008 | 8 | 11 |
| 2009 | 6 | 12 |
| 2010 | 6 | 13 |
| 2011 | 9 | 5 |
| 2012 | 11 | 9 |
| 2013 | 4 | 19 |
| 2014 | 7 | 21 |
| 2015 | 12 | 28 |
| 2016 | 16 | 21 |
| 2017 | 16 | 13 |
| 2018 | 16 | 13 |
| 2019 | 19 | 13 |
| 2020 | 16 | 23 |
| 2021 | 15 | 14 |
| 2022 | 11 | 20 |
| 2023 | 8 | 25 |
| 2024 | 21 | 19 |
| 2025 | 12 | 21 |
| 2026 | 9 | 109 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method of manufacturing circuit board12 May 2026US 12,628,282 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
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Most cited
By later US patents
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Method for manufacturing high-density multilayer printed circuit boards127US 6,119,338 AIndustrial Technology Research Institute · 2000