Package capable of eliminating bubble formation

A package capable of eliminating bubble formation, including:

• a composite substrate having an accommodating space;
• wherein a top surface and a bottom surface of the composite substrate respectively have an upper conductive layer and a lower conductive layer;
• at least one conductive via formed in the composite substrate and electrically connected to the upper conductive layer and the lower conductive layer;
• a die mounted in the accommodating space and having a first surface and a second surface opposite to each other;
• a molding layer covering the composite substrate and filled in the at least one conductive via and the accommodating space to wrap the die;
• a support layer buried in the molding layer and located above the upper conductive layer, wherein
• a thickness of the support layer is at least 10 micrometers;
• a part of the molding layer between a bottom surface of the support layer and the upper conductive layer is defined as a first interval layer;
• another part of the molding layer between a top surface of the support layer and a top surface of the molding layer is defined as a second interval layer;
• and
• a thickness of each of the first interval layer and the second interval layer is at least 5 micrometers;
• and
• a redistribution layer mounted on the molding layer and electrically connected to the first surface of the die and the upper conductive layer;
• wherein the molding layer is formed by laminating a first insulating sheet and a second insulating sheet;
• the support layer is comprised in the second insulating sheet;
• and the first insulating sheet and the second insulating sheet are heated to a semi-curing state to flow into and fill the at least one conductive via and the accommodating space.