H05K 3/0091
Apparatus for coating printed circuits using liquid non-metallic coating compositions
Official title: {Apparatus for coating printed circuits using liquid non-metallic coating compositions}
H05K3/0091 (Apparatus for coating printed circuits using liquid non-metallic coating compositions) appears on 260 US grants and 202 published applications in this corpus.
Search patents in H05K- Granted patents
- 260
- Published applications
- 202
- Assignees
- 173
- Inventors
- 577
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 8 | 0 |
| 1992 | 6 | 0 |
| 1993 | 12 | 0 |
| 1994 | 14 | 0 |
| 1995 | 8 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 2 |
| 2002 | 5 | 1 |
| 2003 | 3 | 5 |
| 2004 | 2 | 7 |
| 2005 | 1 | 10 |
| 2006 | 3 | 1 |
| 2007 | 1 | 7 |
| 2008 | 2 | 15 |
| 2009 | 2 | 15 |
| 2010 | 8 | 10 |
| 2011 | 13 | 4 |
| 2012 | 7 | 5 |
| 2013 | 6 | 9 |
| 2014 | 7 | 9 |
| 2015 | 9 | 33 |
| 2016 | 7 | 9 |
| 2017 | 12 | 11 |
| 2018 | 9 | 5 |
| 2019 | 13 | 5 |
| 2020 | 5 | 7 |
| 2021 | 5 | 9 |
| 2022 | 6 | 3 |
| 2023 | 5 | 6 |
| 2024 | 4 | 5 |
| 2025 | 3 | 5 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dispenser and lifting device of dispenser1 Sep 2026US 12,727,089 B2Illinois Tool Works Inc.
- Manufacturing system11 Aug 2026US 12,706,428 B2TE Connectivity Solutions GmbH
- Reel-to-reel circuit board manufacturing apparatus5 May 2026US 12,621,935 B2Haesung Ds Co., Ltd.
- Hydrophobic low-dielectric-constant film and preparation method therefor8 Jul 2025US 12,351,911 B2Jiangsu Favored Nanotechnology Co., Ltd.
- Circuit board with anti-corrosion properties and electronic device having the same1 Apr 2025US 12,267,963 B2Champ Tech Optical (Foshan) Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Method for fabricating curved conformal multilayer circuit by electric-field-driven jet deposition micro-nano 3-dimensional printing based on charge control and system therefor20 Aug 2026US 2026/0247541 A1Qingdao 5D Intelligent Additive Manufacturing Technology Co., Ltd.
- Method for applying a protective layer to a circuit-board assembly2 Jul 2026US 2026/0190247 A1Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg
- Dispenser and lifting device of dispenser11 Sep 2025US 2025/0287507 A1Illinois Tool Works Inc.
Most cited
By later US patents
- Vacuum flash evaporated polymer composites162US 5,681,615 ABattelle Memorial Institute · 1997
- Variable size segmented anode array for electroplating103US 4,828,654 AProtoCAD, Inc. · 1989
- Thermally exfoliated graphite oxide96US 7,658,901 B2The Trustees of Princeton University · 2010
- Method and apparatus for patch coating printed circuit boards91US 4,938,994 AEpicor Technology, Inc. · 1990
- System for performing work on workpieces89US 5,271,953 ADelco Electronics Corporation · 1993