Method for fabricating curved conformal multilayer circuit by electric-field-driven jet deposition micro-nano 3-dimensional printing based on charge control and system therefor

A method for fabricating a curved conformal multilayer circuit by an electric-field-driven (EFD) jet deposition micro-nano 3-dimensional (3D) printing based on charge control, comprising the following steps:

• step (1):
• pretreating a substrate, comprises degreasing and decontaminating the substrate, and then fixing the substrate after the treatment to a printing platform;
• step (2):
• printing a dielectric layer, comprises selecting a dielectric material according to design requirements, placing a prepared printing material into a conformal thin-film dielectric layer printing nozzle, printing a first dielectric layer through a charge injection and an EFD jet deposition micro-nano 3D printing process in combination with optimized process parameters, and fabricating a high-precision curved conformal thin-film dielectric layer through active charge injection and a charge-injection electrowetting effect in combination with the EFD jet deposition micro-nano 3D printing;
• step (3):
• eliminating residual charge in the printed dielectric layer and the substrate;
• step (4):
• printing a conductive-layer conformal circuit, comprises selecting a conductive ink, placing the selected conductive ink into a conformal circuit printing nozzle, printing a first conductive-layer conformal circuit through a non-contact EFD jet deposition micro-nano 3D printing process in combination with the optimized process parameters, and making the printed circuit conductive through curing and sintering treatments;
• step (5):
• printing a dielectric layer, comprises performing the operation of step (2) to print a second or next dielectric layer;
• step (6):
• fabricating vertical interconnect vias, comprises fabricating a plurality of vertical interconnect microvias in the second dielectric layer by using a laser printing module;
• step (7):
• eliminating the residual charge;
• step (8):
• printing a conductive-layer conformal circuit and filling the vertical interconnect vias, comprises performing the operation of step (4) to print a second conductive-layer conformal circuit, then printing a circuit filling the vertical interconnect vias to complete fabrication of a vertical interconnect circuit, and making the printed conformal circuit conductive through curing and sintering treatments;
• step (9):
• repeating the operations of step (5) to step (8) to complete fabrication of all curved conformal dielectric layers and conductive-layer conformal circuits and interlayer vertical interconnect circuits;
• step (10):
• printing a packaging layer;
• and
• step (11):
• performing a post-treatment.