Method of fabricating metal mask
AssigneeDarwin Precisions Corporation
InventorsYun-Pei Yang, Jen-Shun Lin, Yu-Wei Chang
Life of this patent
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Abstract
A method of fabricating a metal mask includes receiving a metal planar substrate and patterning the metal planar substrate. The metal planar substrate includes a first surface and a second surface opposite to the first surface. The patterning the metal planar substrate includes forming strip-shaped structures, forming through holes, and forming a blind hole in a direction from the first surface to the second surface. The through holes extend to the first surface and the second surface. The through holes and the strip-shaped structures are alternately arranged. The blind hole extends across the through holes.
Claims15
A method of fabricating a metal mask, comprising:
- receiving a metal planar substrate, wherein the metal planar substrate comprises:
- a first surface;
- and
- a second surface, opposite to the first surface;
- and
- patterning the metal planar substrate, comprising:
- forming a plurality of strip-shaped structures;
- forming a plurality of through holes, wherein the plurality of through holes extends to the first surface and the second surface, and the plurality of through holes and the plurality of strip-shaped structures are alternately arranged;
- and
- forming a blind hole in a direction from the first surface to the second surface, wherein the blind hole extends across the plurality of through holes.
A method of fabricating a metal mask, comprising:
- receiving a metal planar substrate, wherein the metal planar substrate comprises:
- a first surface;
- and
- a second surface, opposite to the first surface;
- performing a lithography process to form a first pattern on the first surface extending in a first direction, a second pattern on the first surface extending in a second direction and a third pattern corresponding to the first pattern on the second surface, wherein the first direction and the second direction are perpendicular to each other;
- performing an etching process to remove a portion of the metal planar substrate such that a plurality of through holes is formed through the first pattern and the third pattern, and a plurality of blind holes is formed through the second pattern;
- and
- using the plurality of blind holes as bending axis respectively to bend the metal planar substrate such that the metal mask becomes three-dimensional.
Dependencies are inferred from the claim text.