H05K 3/0097
Processing two or more printed circuits simultaneously
Official title: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)}
H05K3/0097 (Processing two or more printed circuits simultaneously) appears on 789 US grants and 770 published applications in this corpus.
Search patents in H05K- Granted patents
- 789
- Published applications
- 770
- Assignees
- 367
- Inventors
- 1,681
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 7 | 0 |
| 1993 | 11 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 10 | 0 |
| 1997 | 16 | 0 |
| 1998 | 15 | 0 |
| 1999 | 24 | 0 |
| 2000 | 15 | 0 |
| 2001 | 23 | 9 |
| 2002 | 20 | 21 |
| 2003 | 21 | 25 |
| 2004 | 22 | 26 |
| 2005 | 20 | 27 |
| 2006 | 14 | 27 |
| 2007 | 19 | 32 |
| 2008 | 21 | 29 |
| 2009 | 16 | 28 |
| 2010 | 13 | 28 |
| 2011 | 14 | 54 |
| 2012 | 28 | 53 |
| 2013 | 36 | 40 |
| 2014 | 31 | 54 |
| 2015 | 40 | 60 |
| 2016 | 48 | 40 |
| 2017 | 40 | 34 |
| 2018 | 25 | 24 |
| 2019 | 36 | 28 |
| 2020 | 24 | 30 |
| 2021 | 28 | 31 |
| 2022 | 21 | 18 |
| 2023 | 19 | 21 |
| 2024 | 19 | 15 |
| 2025 | 8 | 9 |
| 2026 | 11 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof8 Sep 2026US 12,733,112 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Semiconductor package film and manufacturing method thereof11 Aug 2026US 12,707,990 B2Samsung Display Co., Ltd.
- Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof14 Jul 2026US 12,684,704 B2Sanmina Corporation
- Temporary panel rails23 Jun 2026US 12,666,544 B2Rockwell Collins, Inc.
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Device including board member and manufacturing methods27 Aug 2026US 2026/0255481 A1
- Electronic Board with Plated Through Hole and Axial and Radial Annular Protrusions14 May 2026US 2026/0136472 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board23 Apr 2026US 2026/0113844 A1Shinko Electric Industries Co., Ltd.
- Method and system of manufacturing printed wiring board26 Mar 2026US 2026/0089846 A1Sumitomo Electric Printed Circuits, Inc.
Most cited
By later US patents
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- High throughput hole forming system with multiple spindles per station116US 6,174,271 B1Electro Scientific Industries, Inc. · 2001
- Bottom or top jumpered foldable electronic assembly115US 5,949,657 A1999
- RFID label technique111US 6,951,596 B2Avery Dennison Corporation · 2005
- Apparatus for encasing array packages109US 6,332,766 B1Micron Technology, Inc. · 2001