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US 12,733,112 B2Granted
Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSangho Jeong, Yongduk Lee, Kihwan Kim, Changhwa Park, Hyun Hu Lee
Life of this patent
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Abstract
A disclosed circuit board may include: a first insulation layer, a conductive layer disposed on the first insulating layer; a first via layer disposed in the first insulating layer to be connected to the conductive layer; and a first wire layer disposed under the first insulating layer and connected to the first via layer, and a trench extending from the conductive layer to at least a portion of the first insulating layer may be disposed.
Claims13
A circuit board comprising:
- a first insulation layer;
- a conductive layer disposed on an upper surface of the first insulating layer;
- a first via layer disposed in the first insulating layer to be connected to the conductive layer;
- and
- a first wire layer disposed under a lower surface of the first insulating layer and connected to the first via layer;
- and
- a trench extending from the conductive layer through the upper surface of the first insulating layer to at least a portion of the first insulating layer and being spaced apart from the lower surface of the first insulating layer.
4 more elements
A circuit board comprising:
- a first insulation layer;
- a conductive layer disposed on an upper surface of the first insulating layer;
- a first via layer disposed in the first insulating layer to be connected to the conductive layer;
- and
- a first wire layer disposed under a lower surface of the first insulating layer and connected to the first via layer;
- and
- a trench extending from the conductive layer to at least a portion of the first insulating layer,
- wherein the first via layer is tapered in a direction from the lower surface of the first insulating layer to the upper surface of the first insulating layer.
5 more elements
Dependencies are inferred from the claim text.