Back to results
US 2026/0255481 A1Published application
Device including board member and manufacturing methods
OwnerChee Yang Ng, Nurfarena Othmaninventors
Life of this patent
Estimating the term…
Abstract
A device includes a board member having a plurality of areas. Pads for chip bonding are provided in the areas which are coupled to conducting portions on an opposite side of the board member via electrically conducting paths through through holes provided on borders between areas.
Claims16
A device, comprising:
- a board member comprising a first area and a second area on a first side of the board member, the first area including a first electrically conducting pad for bonding to a first chip, the second area including a second electrically conducting pad for bonding to a second chip, the board member further comprising:
- a through hole between the first side and a second side opposite the first side and arranged at a border between the first area and the second area;
- a first electrically conducting path from the first electrically conducting pad through the through hole to a first conducting potion on the second side opposite the first area;
- and
- a second electrically conducting path from the first electrically conducting pad through the through hole to a second conducting potion on the second side opposite the second area.
2 more elements
A device, comprising:
- a board member including:
- an electrically conducting pad on a first side;
- an indentation on a side face of the board member;
- and an electrically conducting path from the electrically conducting pad through the indentation to an electrically conducting portion on the second side;
- and
- a chip bonded to the electrically conducting pad.
3 more elements
A method, comprising:
- stacking a plurality of boards, each board comprising a first area and a second area on a first side of the board, the first area including a first electrically conducting pad for bonding to a first chip, the second area including a second electrically conducting pad for bonding to a second chip, each board further comprising:
- a through hole between the first side and a second side opposite the first side and arranged at a border between the first area and the second area;
- a first electrically conducting path from the first electrically conducting pad through the through hole to a first conducting potion on the second side opposite the first area;
- and a second electrically conducting path from the first electrically conducting pad through the through hole to a second conducting potion on the second side opposite the second area;
- and
- drilling the through hole for the plurality of boards in one drilling operation through all the stacked boards.
3 more elements
Dependencies are inferred from the claim text.