Electronic Board with Plated Through Hole and Axial and Radial Annular Protrusions

Abstract

An electronic board includes a stack having at least one electrically insulating layer structure and a plurality of electrically conductive layer structures. One of the plurality of electrically conductive layer structures is provided on one main surface of the at least one electrically insulating layer structure and a further one of the plurality of electrically conductive layer structures is provided on an opposing main surface of the at least one electrically insulating layer structure. A through hole is formed in the stack and is laterally delimited by conductive material, at least one plating layer provided on at least part of both opposing main surfaces of the stack and on a lateral wall of the stack. An annular axial protrusion is provided at one extremity of the through hole, and an annular radial protrusion is provided at the lateral wall of the stack.

Dependencies are inferred from the claim text.