US 2026/0113844 A1 · WIRING BOARD

Abstract

A wiring board includes a core including a first glass plate, the core having a first primary surface, a second primary surface opposite to the first primary surface, and a side surface continuous with the first primary surface and the second primary surface, the side surface having a plurality of grooves reaching the first primary surface and the second primary surface, a first build-up layer provided on the first primary surface, a second build-up layer provided on the second primary surface, a plurality of through-metal trench layers provided inside the plurality of grooves, respectively, a first metal layer provided on the first primary surface and connected to the plurality of through-metal trench layers, and a second metal layer provided on the second primary surface and connected to the plurality of through-metal trench layers.

Claims13

Dependent claims

A wiring board comprising:

a core including a first glass plate, the core having a first primary surface, a second primary surface opposite to the first primary surface, and a side surface continuous with the first primary surface and the second primary surface, the side surface having a plurality of grooves reaching the first primary surface and the second primary surface;
a first build-up layer provided on the first primary surface;
a second build-up layer provided on the second primary surface;
a plurality of through-metal trench layers provided inside the plurality of grooves, respectively;
a first metal layer provided on the first primary surface and connected to the plurality of through-metal trench layers;
and
a second metal layer provided on the second primary surface and connected to the plurality of through-metal trench layers.

4 more elements

A wiring board comprising:

a core including a first glass plate, the core having a first primary surface and a second primary surface opposite to the first primary surface;
a first build-up layer provided on the first primary surface;
a second build-up layer provided on the second primary surface;
a product region, and a cutting region surrounding the product region in a plan view;
a plurality of through holes reaching the first primary surface and the second primary surface of the core and arranged inside the cutting region in the plan view;
a plurality of through-metal trench layers provided inside the plurality of through holes, respectively;
a first metal layer provided on the first primary surface, arranged inside the cutting region in the plan view, and connected to the plurality of through-metal trench layers;
and
a second metal layer provided on the second primary surface, arranged inside the cutting region in the plan view, and connected to the plurality of through-metal trench layers.

6 more elements

Dependencies are inferred from the claim text.

Wiring board

Life of this patent

Wiring board

Life of this patent

Abstract

Claims13