H05K 3/40
Forming printed elements for providing electric connections to or between printed circuits
H05K3/40 (Forming printed elements for providing electric connections to or between printed circuits) appears on 9,658 US grants and 9,102 published applications in this corpus.
Search patents in H05K- Granted patents
- 9,658
- Published applications
- 9,102
- Assignees
- 2,267
- Inventors
- 16,001
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 35 | 0 |
| 1977 | 24 | 0 |
| 1978 | 29 | 0 |
| 1979 | 12 | 0 |
| 1980 | 27 | 0 |
| 1981 | 28 | 0 |
| 1982 | 29 | 0 |
| 1983 | 35 | 0 |
| 1984 | 36 | 0 |
| 1985 | 59 | 0 |
| 1986 | 59 | 0 |
| 1987 | 72 | 0 |
| 1988 | 73 | 0 |
| 1989 | 90 | 0 |
| 1990 | 111 | 0 |
| 1991 | 99 | 0 |
| 1992 | 107 | 0 |
| 1993 | 116 | 0 |
| 1994 | 128 | 0 |
| 1995 | 149 | 0 |
| 1996 | 149 | 0 |
| 1997 | 169 | 0 |
| 1998 | 223 | 0 |
| 1999 | 227 | 0 |
| 2000 | 226 | 0 |
| 2001 | 276 | 144 |
| 2002 | 295 | 359 |
| 2003 | 328 | 367 |
| 2004 | 355 | 407 |
| 2005 | 239 | 401 |
| 2006 | 275 | 450 |
| 2007 | 263 | 457 |
| 2008 | 281 | 481 |
| 2009 | 239 | 487 |
| 2010 | 314 | 379 |
| 2011 | 282 | 315 |
| 2012 | 357 | 317 |
| 2013 | 274 | 319 |
| 2014 | 211 | 356 |
| 2015 | 270 | 376 |
| 2016 | 327 | 362 |
| 2017 | 362 | 385 |
| 2018 | 322 | 361 |
| 2019 | 383 | 354 |
| 2020 | 335 | 366 |
| 2021 | 315 | 299 |
| 2022 | 259 | 319 |
| 2023 | 219 | 276 |
| 2024 | 246 | 259 |
| 2025 | 193 | 241 |
| 2026 | 126 | 265 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Circuit board structure and manufacturing method thereof6 Oct 2026US 12,757,334 B2Unimicron Technology Corp.
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Connection structure for yarn wire and circuit board15 Sep 2026US 12,739,980 B2Makalot Industrial Co., Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Component Carrier With Embedded Vertical Connection, And Manufacture Method1 Oct 2026US 2026/0304619 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011